JPH022538Y2 - - Google Patents

Info

Publication number
JPH022538Y2
JPH022538Y2 JP17236684U JP17236684U JPH022538Y2 JP H022538 Y2 JPH022538 Y2 JP H022538Y2 JP 17236684 U JP17236684 U JP 17236684U JP 17236684 U JP17236684 U JP 17236684U JP H022538 Y2 JPH022538 Y2 JP H022538Y2
Authority
JP
Japan
Prior art keywords
solder
tank
solder melt
jet
notches
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP17236684U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6187659U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17236684U priority Critical patent/JPH022538Y2/ja
Publication of JPS6187659U publication Critical patent/JPS6187659U/ja
Application granted granted Critical
Publication of JPH022538Y2 publication Critical patent/JPH022538Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP17236684U 1984-11-15 1984-11-15 Expired JPH022538Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17236684U JPH022538Y2 (en]) 1984-11-15 1984-11-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17236684U JPH022538Y2 (en]) 1984-11-15 1984-11-15

Publications (2)

Publication Number Publication Date
JPS6187659U JPS6187659U (en]) 1986-06-07
JPH022538Y2 true JPH022538Y2 (en]) 1990-01-22

Family

ID=30730033

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17236684U Expired JPH022538Y2 (en]) 1984-11-15 1984-11-15

Country Status (1)

Country Link
JP (1) JPH022538Y2 (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0444305Y2 (en]) * 1987-04-16 1992-10-19

Also Published As

Publication number Publication date
JPS6187659U (en]) 1986-06-07

Similar Documents

Publication Publication Date Title
US4530457A (en) Wave-soldering of printed circuit boards
JPH01500888A (ja) 波動はんだフィンガ遮蔽装置
JPH022538Y2 (en])
US3053215A (en) Apparatus for soldering printed sheets
JPH022539Y2 (en])
EP0055323B1 (en) Apparatus for soldering chip type components
US4410127A (en) Method of soldering pins to printed circuit boards, and soldering bath for this method
US20020047039A1 (en) Automatic wave soldering apparatus and method
US4284225A (en) Apparatus for soldering components mounted at printed wiring boards
JPS6040948B2 (ja) プリント基板のはんだ付け装置
US5554412A (en) Solder spray leveller
JP2004356161A (ja) 自動はんだ付け装置
SU925569A1 (ru) Устройство дл лужени
JPH072139Y2 (ja) スポット半田付装置
JPH0227971Y2 (en])
JPH0444305Y2 (en])
JPS6113159Y2 (en])
JP2715400B2 (ja) フラックス塗布装置
JPS5922933Y2 (ja) はんだ付け装置
JP2815777B2 (ja) 噴流式半田付け装置
JPH0442057Y2 (en])
JPS6317572Y2 (en])
JPH0248137Y2 (en])
JP2767832B2 (ja) プリント基板の半田付方法
JP2580843Y2 (ja) プリント基板の水平ディップ型半田塗布装置